VLSI Definitions | |
| Definitions of the terms that are often used in Chip design world. Please help us to improve the list. You can add VLSI terms and its definitions with out registering in the site. | |
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| There are 257 entries in the glossary. | |
| Pages: «1 2 3 4 5 6 7 8 9 » | |
| Term | Definition |
| circuit port | An input or output \"pin\" of a circuit element. For example, a two-input NAND gate would have three ports--two inputs and one output. |
| CMP | Chemical Mechanical Polishing: A polishing process used to make the fabrication wafers as flat as possible. |
| Comparator | A comparator is a device that accepts two analog inputs, compares the inputs, and produces a binary output that is a function of which input is higher. |
| Conductor | Any material, such as aluminum, copper or gold, that offers little resistance to the flow of electrical current. |
| Core | A pre-designed block that requires little or no further development or verification effort to use as an element in a complex System–on-Chip (SoC) design. |
| core logic | The portion of a circuit that implements the circuit\'s primary functions. |
| CPFC - Canadian Photonics Fabrication Ce | A facility which provides prototyping, manufacturing, and testing services to universities and industry for unique photonic and optoelectronic components thereby reducing time to market. |
| CVD | A SEMICON process used to deposit material onto a wafer using chemical reactions on the wafer surface to modify the material during processing. |
| DAC | A data converter, or DAC, that receives digital data and outputs a voltage or current proportional to the value of the digital data. |
| Debug | The act of diagnosing, fixing, or removing bugs from a computer programs. |
| Defect | A physical flaw in a microcircuit that may inhibit microcircuit performance or that may cause a chain of events that will inhibit performance in the near future. Defects include gate oxide shorts, interconnect imperfections, leaky reverse-bias pn junctions, etc. |
| Defect | An imperfection in the surface structure of a microchip that can cause one or more chips to malfunction. |
| delay fault | A fault revealing a manufacturing defect or design flaw that causes a signal to be delayed outside of its specified delay. |
| Demux (Demultiplexer) | A logic circuit that takes a single input and sends it to one of several outputs. |
| Deposition | The procedure in which materials are deposited onto a substrate. Usually refers to thin conducting or insulating films used to form MOS gates, capacitors, thin-film resistors, and the interconnect system for an IC. |
| Design Flow | A documented sequence of activities undertaken by a chip or system designer to accomplish a specific design goal. A formal step-by-step description of a particular design methodology. |
| Design Kit | A collection of technical information, software, and computer data files that enable a design engineer to model, simulate, and layout microsystems modules using a specific technology |
| Design verification | A variety of computer simulation procedures used to determine whether a design conforms to its specification. These tools verify the function, performance, testability, radiation hardness, and other specified aspects of a design. |
| Develop | A synonym for programming. It describes the act of creating a computer program. |
| DFT | Design For Testability or DFT refers to design techniques that make products easier to test. |
| Die | The square or rectangular section of a wafer onto which an single integrated circuit is fabricated. |
| Digital Light Processing. | A micromirror display technology commercialized by Texas Instruments. Each image pixel in a large array is represented by an electrostatic driven MEMS Mirror. This reflective technology is far brighter than transmission LCD technology. Technology is widely licensed to conference display projector manufactures such as Proxima and InFocus. |
| Dimple | A small feature or bump, typically a raised square on the surface of a MEMS device. Dimple can be used as mechanical stops. e.g. to control the touch down in a high aspect ratio device. |
| Diode | An electronic device with two electrodes/terminals, one called the cathode and the other the anode, and a single PN junction. |
| Direct current | A type of electrical current that moves in one direction at a constant rate. |
| Doping | Atoms with one less electron than silicon (such as boron), or one more electron than silicon (such as phosphorous), are introduced into the area exposed by the etch process to alter the electrical character of the silicon. These areas are called P-type (boron) or N-type (phosphorous) to reflect their conducting characteristics. |
| DRAM | Dynamic Random-Access Memory that uses a continuous clock. |
| DRC | A process, typically fully automated by the layout EDA software that check a layout for fabrication feasibility based on a built in knowledge base. |
| DRIE | Deep Reactive Ion Etching. A fabrication technology that allows lower aspect ratio devices or deep features. |
| Dry oxidation | Process of thermal oxidation carried out in the moisture-free oxygen. |
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