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VLSI Definitions
           Definitions of the terms that are often used in Chip design world. Please help us to improve the list. You can add VLSI terms and its definitions with out registering in the site.

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There are 257 entries in the glossary.
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Term Definition
SPICESimulation Program for Integrated Circuits Emphasis. An Electronic Circuit simulator used to verify circuit designs and predict the circuit behavior.
 
Sputter yieldEfficiency of the sputtering process; different for different materials.
 
Standard CellStandard cells are designed to be interconnected with other cells from the same cell library.
 
Standard evaluation circuitA device used for maintaining qualification of a QML fabrication line, it is typically a memory device.
 
Stuck-at faultA deduction about a circuit problem based on a comparison of expected logical outputs to actual outputs. The underlying assumption is that a gate input or output is inhibited by a defect from switching states and is \"stuck at\" a particular value.
 
Surface MicromachiningAn additive fabrication technique which involves the building of a device on the top surface of a supporting substrate. This technique is relatively independent of substrate; therefore, it can be easily mixed with other fabrication techniques which modify the substrate first.
 
SynthesisThe CAD operation of automatically generating an integrated circuit layout from a high-level description.
 
System LevelA behavioural description of a system that is an abstraction of the hardware/software implementation level.
 
T-SpiceA version of SPICE developed by Tanner Research Labs and part of MEMS Pro.
 
Technology FileA file that is normally paired with a 2-D layout file that describes the fabrication process steps required to achieve the 3-D finished MEMS or IC.
 
Test vectorsA set of circuit stimuli and expected circuit responses that are used to first test a circuit simulation and ultimately fabricated devices.
 
Thermal ActuatorAn electro-thermally actuated MEMS device. A current passed though the device causes Joule (I2R) heating resulting in differential thermal expansion of the device, which can be used to extract a relatively large mechanical deformation.
 
Toggle coverageThe ratio of the number of nodes toggled by a set of test vectors to the total nodes in a circuit.
 
Top-down design methodologyA method of controlling the complexity of design development. Top down design begins with the most abstract description of a system, and breaks this into subdescriptions. The lowest level should describe those devices purchased outside of the organization.
 
TransistorA Transistor is a basic solid-state control device which allows or disallows current flow between two terminals, based on the voltage or current delivered to a third terminal.
 
UARTUniversal Asynchronous Receiver-Transmitter is an IC that converts parallel data to serial, for transmission; and converts received serial data to parallel data.
 
ULSIA microchip with over one million transistors. Most popular chips today fit this description.
 
Ultra-thin-oxideoxide thin enough to allow substantial direct tunneling current between metal gate and semiconductor substrate in MOS devices; typically thinner than 3 nm.
 
Ultraviolet Electron SpectroscopyMethod of material characterization, based on the emission of photoelectrons from the solid stimulated by UV irradiation
 
Unbuffered MemoryMemory modules that do not support Error Checking and Correcting (ECC) or parity checking functionality.
 
UndercutUndesired result of the isotropic etching process; etched pattern extends under the resist limiting resolution of the pattern definition process.
 
Uni-polar devicesemiconductor device which operation is based predominantly on the use of majority charge carriers
 
Uni-polar transistorsynonymous with Field Effect Transistor, FET, i.e. transistor which operation is controlled by majority carriers only.
 
ValidationThe processes of comparing the behaviour of a physical system against the original design specification.
 
VerificationThe process of measuring the behaviour of the system in relation to specific benchmarks.
 
VLSIVLSI: Very Large Scale Integration:The fabrication technology for concentrating many thousands of semiconductor devices into a single integrated circuit. Strictly speaking VLSI is in the range of >10,000 transistors but less than 1,000,000 transistors.
 
Volatile memoryMemory in which stored information is lost when power to the memory cell is turned off.
 
Volume defectvoids and/or local regions featuring different phase (e.g. precipitates or amorphous phase)in crystalline materials.
 
WaferSemiconductor manufacturing begins with a thin disk of semiconductor material, called a \"wafer.\" The wafer is then sliced into \"dice\" which are mounted in packages, creating the IC.
 
Wafer BondingProcess in which two semiconductor wafers are bonded to form a single substrate featuring specific properties; commonly applied to form SOI substrates;
 


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