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VLSI Definitions
           Definitions of the terms that are often used in Chip design world. Please help us to improve the list. You can add VLSI terms and its definitions with out registering in the site.

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There are 12 entries in the glossary.
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Term Definition
WaferSemiconductor manufacturing begins with a thin disk of semiconductor material, called a \"wafer.\" The wafer is then sliced into \"dice\" which are mounted in packages, creating the IC.
Wafer BondingProcess in which two semiconductor wafers are bonded to form a single substrate featuring specific properties; commonly applied to form SOI substrates;
Wafer chargingProcess of acquiring static electric charge by the wafer during processing; highly undesired effect that needs to be monitored and controlled.
Wafer DiameterDepending on material and needs semiconductor substrates are available in the form of circular \"wafers\" 0.5 mm to 1 mm thick and ranging in diameter from 1 inch (25 mm) to 12 inch (300 mm).
wafer fabSemiconductor processing facility which turns wafers into integrated circuits.
Wafer FabricationProcess in which single crystal semiconductor in the form of a rod or boule in transformed by cutting, grinding, polishing, and cleaning into circular wafer (with desired diameter) used in semiconductor manufacturing.
Wafer flatA feature machined at the perimeter of the semiconductor wafer; location and number of wafer flats contain information on the orientation of the crystal and the dopant type.
WatchdogA feature of a microprocessor supervisory circuit that monitors software execution in a microprocessor or microcontroller. It takes appropriate action if the processor gets stuck in an infinite execution loop.
Wet ecthingEtching process in semiconductor processing relying on chemical reaction in the liquid phase; highly isotropic but can be very selective.
Wet oxidationThermal oxidation of silicon carried out in water vapor containing oxygen, or in steam; significantly higher oxide growth rate as compared to dry oxidation; used to form relatively thick films of SiO2 on Si surface;
Wire bondingPart of the chip assembly process in which very thin (about 30 micrometer in diameter) gold wire is used to connect chip and the package;
Worst-caseA version or versions of a circuit whereby certain key distributed parameters, such as temperature, process variation, and radiation effects, are set to values within their specified ranges that cause the circuit to have maximum deviation from its nominal operation.

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